HUAWEI Tecal ES3000 PCIe SSD card provides 800GB/1.2TB/2.4TB capacities, full-height half-length form factor, up to 770K (4KB block) read IOPS performance and up to 630K (4KB block) write IOPS performance, up to 3.2GB/s throughput bandwidth, support power-down protection.
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Items
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Specifications
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Capacity |
800GB |
1.2TB |
2.4TB |
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Flash granule |
MLC |
MLC |
MLC |
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Form factor |
Full-height, half-length |
Full-height, half-length |
Full-height, half-length |
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Bus interface |
PCIe 2.0 x8 |
PCIe 2.0 x8 |
PCIe 2.0 x8 |
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Maximum read bandwidth |
2.2 GB/s |
3.2 GB/s |
3.2 GB/s |
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Read IOPS (Stable value, 4 KB, 100% random) |
570,000 |
760,000 |
760,000 |
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Read IOPS (Maximum value, 4 KB, 100% random) |
600,000 |
770,000 |
770,000 |
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Minimum read latency |
49 µs |
49 µs |
49 µs |
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Maximum write bandwidth |
1.2 GB/s |
1.8 GB/s |
2.8 GB/s |
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Write IOPS (Stable value, 4 KB, 100% random) |
120,000 |
180,000 |
240,000 |
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Write IOPS (Maximum value, 4 KB, 100% random) |
330,000 |
480,000 |
630,000 |
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Minimum write latency |
8 µs |
8 µs |
8 µs |
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Mixed IOPS (Stable value, 4 KB, R/W:7/3) |
260,000 (R/W: 180,000/80,000) |
400,000 (R/W: 280,000/120,000) |
430,000 (R/W: 300,000/130,000) |
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Power consumption |
20 W to 35 W |
25 W to 50 W |
25 W to 60 W |
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Weight |
300g |
350g |
350g |
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Power-down protection |
Yes |
Yes |
Yes |
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Granules failure protection |
Yes |
Yes |
Yes |
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Supported trim |
Yes |
Yes |
Yes |
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Operate systems |
MS Windows Server 2003 SP2/2008 R2 64-bit |
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Environmental Specifications |
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Operating temperature |
0℃
to 55℃
(air flow 300 LFM) |
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Storage temperature |
-40℃
to 70℃ |
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Operating humidity |
5% RH to 85% RH |
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Altitude |
≤ 3000 m |
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International Standards |
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US/Canada |
FCC CFR47 Part 15 Class A |
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Europe |
IEC 60950-1:2005 (2nd Edition) + A1:2009 and/or |
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Japan |
VCCI Class A |
For more details, please refer to HUAWEI Tecal ES3000 High Performance PCIe SSD Card Brochure (PDF).
