With enhanced thermally conductive non-curing compound, IceFusion provides excellent performance and stability. It is optimized for use between CPUs, and heatsinks or water-cooling solutions.

High Thermal Conductivity.
Low Thermal Resistance.
Non-Corrosive.
Best Thermal Stability in High Temperature.
Excellent Adhesion.
Preservation in Room Temperature.
Easy Application with Included Razor Blade.
Up to 100 applications