With enhanced thermally conductive non-curing compound, IceFusion provides excellent performance and stability. It is optimized for use between CPUs, and heatsinks or water-cooling solutions.



Feature:

??? High thermal conductivity.

??? Low thermal resistance.

??? Non-corrosive.

??? Best thermal stability in high temperature.

??? Excellent adhesion.

??? Preserve in room temperature for longer lifespan.

??? Up to 500 applications