Antec's Formula 6 thermal compound protects your CPU even when your rig is running on all cylinders. Since little of the CPU's surface actually touches the heat sink, you need a solution that isolates and facilitates the transfer of heat. Formula 6's nano diamond particles minimize the distance between heat-conductive compounds and gladly take on the highest demanding CPU, optimally performing between -30??C and 250??C. To keep your system cool and your CPU functioning comfortably, pick up Antec??s Formula 6 for a diamond-caliber solution
1.Diamond particles measuring 0.0000015 cm rated at 5.3 w/mK
2.Lighter, easier to spread stable composition wont crack or dry out
3.Quantity: 4 g
4.Specific gravity: 2.2 g/cm3
Item Dimension (L"xW"xH"):
0.7 x 1.1 x 3
Weight :
1.0 lb
Warranty Information:
3 Years