HyperX HX321LS11IBK2/8 is a kit of two 512M x 64-bit (4GB) DDR3L-2133 CL11 SDRAM (Synchronous DRAM) 1Rx8, low voltage, memory modules, based on eight 512M x 8-bit DDR3 FBGA components per module. Total kit capacity is 8GB. Each module kit has been tested to run at DDR3L-2133 at a low latency timing of 11-12-13 at 1.35V or 1.5V. Additional timing parameters are shown in the PnP Timing Parameters section below. The JEDEC standard electrical and mechanical specifications are as follows:
Features:
??? JEDEC standard 1.35V and 1.5V
??? VDDQ = 1.35V and 1.5V
??? 1066MHz fCK for 2133Mb/sec/pin
??? 8 independent internal bank
??? Programmable CAS Latency: 15, 14, 13, 12, 11, 10, 9, 8, 7, 6
??? Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
??? 8-bit pre-fetch
??? Burst Length: 8 (Interleave without any limit, sequential with starting address ???000??? only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
??? Bi-directional Differential Data Strobe
??? Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ?? 1%)
??? On Die Termination using ODT pin
??? Average Refresh Period 7.8us at lower than TCASE 85??C, 3.9us at 85??C < TCASE < 95??C
??? Asynchronous Reset
??? PCB : Height 1.180??? (30.00mm), double sided component
PnP JEDEC TIMING PARAMETERS:
??? DDR3-2133 CL11-12-13 at 1.35V or 1.5V
??? DDR3-1866 CL10-11-12 at 1.35V or 1.5V
??? DDR3-1600 CL9-9-10 at 1.35V or 1.5V
Capacity
8GB
Kit
2 x 4GB
Memory Type
DDR3L 2133
DIMM Type
SODIMM
Voltage
1.35V
CL (IDD)
11 Cycles
Row Cycle Time (tRCmin)
44.22ns (min.)
Refresh to Active/Refresh Command Time (tRFCmin)
260ns (min.)
Row Active Time (tRASmin)
31.875ns (min)
Maximum Operating Power
TBD W at 1.35V
UL Rating
94V - 0
Operating Temperature
0 C to 85 C
Storage Temperature
-55 C to +100 C
Item Dimension (L"xW"xH")
3.67 x 6.7 x 0.52
Weight
0.25 lb
Warranty Information
Lifetime Manufacture